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Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
507302B00000G

507302B00000G

HEATSINK TO-220 2.5W LOW PROFILE

Boyd Laconia, LLC

31,204 -
RFQ
507302B00000G

Datenblatt

- Bulk Active Board Level TO-220 Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) Bolt On 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
574502B00000G

574502B00000G

HEATSINK TO-220 VERT MNT .75"

Boyd Laconia, LLC

39,642 -
RFQ
574502B00000G

Datenblatt

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
290-1AB

290-1AB

HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette

4,488 -
RFQ
290-1AB

Datenblatt

290 Bulk Active Board Level TO-218, TO-202, TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
V-1100-SMD/B-L

V-1100-SMD/B-L

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

6,405 -
RFQ
V-1100-SMD/B-L

Datenblatt

- Bulk Active Top Mount TO-252 (DPak) Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) SMD Pad - - 25.00°C/W Copper Tin
V-1100-SMD/A-L

V-1100-SMD/A-L

HEATSINK TO-263 12.70X26.20MM

Assmann WSW Components

4,987 -
RFQ
V-1100-SMD/A-L

Datenblatt

- Bulk Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) SMD Pad - - 23.00°C/W Copper Tin
577102B04000G

577102B04000G

HEATSINK TO-220 W/TAB .375"

Boyd Laconia, LLC

21,002 -
RFQ
577102B04000G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) Bolt On and PC Pin 1.0W @ 30°C 8.00°C/W @ 400 LFM 25.90°C/W Aluminum Black Anodized
V2017B

V2017B

HEATSINK ANOD ALUM CPU

Assmann WSW Components

3,057 -
RFQ
V2017B

Datenblatt

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) - - - 31.00°C/W Aluminum Black Anodized
V6560W

V6560W

HEATSINK ALUM ANOD

Assmann WSW Components

4,885 -
RFQ
V6560W

Datenblatt

- Tray Active Board Level TO-220 Rectangular, Fins 0.984" (25.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) Bolt On and PC Pin - - 10.00°C/W Aluminum Black Anodized
V-1100-SMD/B

V-1100-SMD/B

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

14,896 -
RFQ
V-1100-SMD/B

Datenblatt

- Tape & Reel (TR) Active Top Mount TO-252 (DPak) Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) SMD Pad - - 25.00°C/W Copper Tin
287-1ABE

287-1ABE

HEATSINK FOR TO220

Wakefield-Vette

3,947 -
RFQ
287-1ABE

Datenblatt

287 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
577202B00000G

577202B00000G

HEAT SINK TO-220 .500" COMPACT

Boyd Laconia, LLC

11,197 -
RFQ
577202B00000G

Datenblatt

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) Bolt On 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
576802B04000G

576802B04000G

HEAT SINK VERT PLUG-IN TO-220

Boyd Laconia, LLC

12,560 -
RFQ
576802B04000G

Datenblatt

- Bulk Active Board Level, Vertical TO-220, TO-262 Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
577102B00000G

577102B00000G

HEAT SINK TO-220 .375" COMPACT

Boyd Laconia, LLC

778 -
RFQ
577102B00000G

Datenblatt

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) Bolt On 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Aluminum Black Anodized
110991327

110991327

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

22,678 -
RFQ
110991327

Datenblatt

- Bulk Active Top Mount Kit Raspberry Pi 4B - - - - - Adhesive - - - Aluminum -
573300D00010G

573300D00010G

HEATSINK D2PAK .4" HIGH SMD

Boyd Laconia, LLC

21,954 -
RFQ
573300D00010G

Datenblatt

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) SMD Pad 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Aluminum Tin
658-25AB

658-25AB

HEATSINK CPU 28MM SQ BLK

Wakefield-Vette

10,734 -
RFQ
658-25AB

Datenblatt

658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Not Included) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
HSB05-171711

HSB05-171711

HEAT SINK, BGA, 17 X 17 X 11.5 M

Same Sky (Formerly CUI Devices)

6,249 -
RFQ
HSB05-171711

Datenblatt

HSB Box Active Top Mount BGA Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.453" (11.50mm) Adhesive (Not Included) 3.1W @ 75°C 8.40°C/W @ 200 LFM 23.91°C/W Aluminum Alloy Black Anodized
574502B03300G

574502B03300G

HEATSINK TO-220 VERT MNT W/TAB

Boyd Laconia, LLC

8,221 -
RFQ
574502B03300G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
658-60AB

658-60AB

HEATSINK CPU 28MM SQ BLK W/OTAPE

Wakefield-Vette

133 -
RFQ
658-60AB

Datenblatt

658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) Thermal Tape, Adhesive (Not Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
573100D00010G

573100D00010G

HEATSINK SMT D-PAK/TO-252 TIN

Boyd Laconia, LLC

11,190 -
RFQ
573100D00010G

Datenblatt

5731 Tape & Reel (TR) Active Top Mount TO-252 (DPak) Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - 0.400" (10.16mm) SMD Pad 0.8W @ 30°C 12.50°C/W @ 600 LFM 26.00°C/W Aluminum Tin
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