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Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
513102B02500G

513102B02500G

HEATSINK TO-220 W/PINS 1.5"TALL

Boyd Laconia, LLC

4,060 -
RFQ
513102B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
3083

3083

ALUM HEAT SINK FOR RASPBERRY PI

Adafruit Industries LLC

2,534 -
RFQ
3083

Datenblatt

- Bulk Active Top Mount Raspberry Pi 3 Square, Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.315" (8.00mm) Thermal Tape, Adhesive (Included) - - - Aluminum -
LTN20069

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Wakefield-Vette

5,849 -
RFQ
LTN20069

Datenblatt

Penguin Bulk Active Board Level Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) - 0.350" (8.89mm) Thermal Tape, Adhesive (Included) - 8.00°C/W @ 500 LFM - Aluminum Black Anodized
513201B02500G

513201B02500G

HEATSINK TO-218/TO-247 W/PINS 2"

Boyd Laconia, LLC

1,697 -
RFQ
513201B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-218 Rectangular, Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 20°C 3.00°C/W @ 400 LFM 8.30°C/W Aluminum Black Anodized
637-10ABPE

637-10ABPE

HEATSINK TO-220 VERT MT BLK 1"

Wakefield-Vette

2,170 -
RFQ
637-10ABPE

Datenblatt

637 Box Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and Board Mounts 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
V-1102-SMD/A-L

V-1102-SMD/A-L

HEATSINK TO-263 19.38X25.40MM

Assmann WSW Components

4,655 -
RFQ
V-1102-SMD/A-L

Datenblatt

- Bulk Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) SMD Pad - 23.00°C/W @ 300 LFM 11.00°C/W Copper Tin
DV-T263-201E-TR

DV-T263-201E-TR

HEATSINK FOR TO-263

Ohmite

10,676 -
RFQ
DV-T263-201E-TR

Datenblatt

D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.480" (12.19mm) Solderable Feet 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
6025DG

6025DG

HEATSINK TO-220 STAGGEREDFIN TIN

Boyd Laconia, LLC

8,081 -
RFQ
6025DG

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.250" (31.75mm) 0.875" (22.23mm) - 0.250" (6.35mm) Bolt On and PC Pin 3.0W @ 60°C 7.00°C/W @ 400 LFM 17.90°C/W Copper Tin
TGH-0075-01

TGH-0075-01

ALUMINIUM HEAT SINK 7.5X7.5MM

t-Global Technology

747 -
RFQ
TGH-0075-01

Datenblatt

TGH Bulk Active Top Mount - Square, Fins 0.295" (7.50mm) 0.295" (7.50mm) - 0.394" (10.00mm) - - - - Aluminum Clean Anodized
V5618A

V5618A

HEATSINK ALUM ANOD

Assmann WSW Components

24,969 -
RFQ
V5618A

Datenblatt

- Bulk Active Top Mount 6-Dip and 8-Dip Rectangular, Fins 0.334" (8.50mm) 0.250" (6.35mm) - 0.189" (4.80mm) Press Fit - - 80.00°C/W Aluminum Black Anodized
375424B00034G

375424B00034G

HEATSINK PIN-FIN W/TAPE

Boyd Laconia, LLC

2,277 -
RFQ
375424B00034G

Datenblatt

- Bulk Active Top Mount BGA Square, Pin Fins 0.598" (15.19mm) 0.598" (15.19mm) - 0.252" (6.40mm) Thermal Tape, Adhesive (Included) - 17.60°C/W @ 200 LFM 62.50°C/W Aluminum Black Anodized
3082

3082

ALUM HEATSINK FOR RASPBERRY PI

Adafruit Industries LLC

1,139 -
RFQ
3082

Datenblatt

- Bulk Active Top Mount Raspberry Pi 3 Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.590" (15.00mm) Thermal Tape, Adhesive (Included) - - - Aluminum -
110991328

110991328

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

2,602 -
RFQ
110991328

Datenblatt

- Bulk Active Top Mount Kit Raspberry Pi 4B - - - - - Adhesive - - - Aluminum -
374024B00035G

374024B00035G

HEATSINK BGA 23X23X10MM W/ADH

Boyd Laconia, LLC

1,892 -
RFQ
374024B00035G

Datenblatt

- Bulk Active Top Mount BGA Square, Pin Fins 0.906" (23.01mm) 0.906" (23.01mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 1.0W @ 40°C 11.70°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
529702B02500G

529702B02500G

BOARD LEVEL HEATSINK 1" TO-220

Boyd Laconia, LLC

2,157 -
RFQ
529702B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 4.0W @ 30°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
657-20ABEP

657-20ABEP

HEATSINK TO-220 W/PINS BLK 2"

Wakefield-Vette

9,777 -
RFQ
657-20ABEP

Datenblatt

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) Bolt On and PC Pin 6.0W @ 32°C 2.90°C/W @ 200 LFM 5.30°C/W Aluminum Black Anodized
647-15ABPE

647-15ABPE

HEATSINK TO-220 W/PINS BLK 1.5"

Wakefield-Vette

3,550 -
RFQ
647-15ABPE

Datenblatt

647 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 6.0W @ 37°C 3.50°C/W @ 200 LFM - Aluminum Black Anodized
7109D/TRG

7109D/TRG

HEATSINK TO-263 (D2PK)

Boyd Laconia, LLC

9,031 -
RFQ
7109D/TRG

Datenblatt

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) SMD Pad 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
624-25ABT4E

624-25ABT4E

HEATSINK CPU 21MM SQ W/DBL TAPE

Wakefield-Vette

1,017 -
RFQ
624-25ABT4E

Datenblatt

624 Bulk Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
DV-T263-101E-TR

DV-T263-101E-TR

TO-263 HEAT SINK / POLY TAPE

Ohmite

2,480 -
RFQ
DV-T263-101E-TR

Datenblatt

D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.400" (10.16mm) Solderable Feet 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
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