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Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
R2A-CT4-38E

R2A-CT4-38E

HEATSINK FOR TO-247

Ohmite

1,212 -
RFQ
R2A-CT4-38E

Datenblatt

R2 Box Active Board Level TO-247 Rectangular, Fins 1.500" (38.10mm) 1.380" (35.05mm) - 0.870" (22.10mm) Clip and PC Pin 2.0W @ 20°C 1.00°C/W @ 800 LFM 8.60°C/W Aluminum Black Anodized
542502B00000G

542502B00000G

HEATSINK TO-220 TAB BLACK

Boyd Laconia, LLC

3,146 -
RFQ
542502B00000G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) Bolt On and PC Pin 2.5W @ 60°C 4.00°C/W @ 700 LFM 24.00°C/W Aluminum Black Anodized
7-340-2PP-BA

7-340-2PP-BA

HEATSINK PWR DUAL BLACK TO-220

CTS Thermal Management Products

1,400 -
RFQ
7-340-2PP-BA

Datenblatt

7 Box Active Board Level TO-220 Rectangular, Fins 1.500" (38.10mm) 1.150" (29.21mm) - 0.460" (11.68mm) Bolt On 9.0W @ 60°C - 6.67°C/W Aluminum Black Anodized
RA-T2X-51E

RA-T2X-51E

HEATSINK TO-218,TO-220,TO-247

Ohmite

1,525 -
RFQ
RA-T2X-51E

Datenblatt

R Box Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.654" (42.00mm) 0.985" (25.00mm) - 2.000" (50.80mm) Bolt On and PC Pin 8.0W @ 40°C 1.00°C/W @ 300 LFM 3.50°C/W Aluminum Black Anodized
ATS-CPX025025015-138-C2-R0

ATS-CPX025025015-138-C2-R0

HEATSINK 25X25X15MM L-TAB CP

Advanced Thermal Solutions Inc.

1,822 -
RFQ
ATS-CPX025025015-138-C2-R0

Datenblatt

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) Push Pin - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
573400D00010G

573400D00010G

HEATSINK D-PAK3 TIN PLATED SMD

Boyd Laconia, LLC

2,500 -
RFQ
573400D00010G

Datenblatt

- Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.401" (10.20mm) SMD Pad 1.0W @ 20°C 4.00°C/W @ 600 LFM 14.00°C/W Copper Tin
590102B03600G

590102B03600G

HEATSINK TO-220 W/TABS 1.67"HIGH

Boyd Laconia, LLC

5,129 -
RFQ
590102B03600G

Datenblatt

- Tray Active Board Level, Vertical TO-220 Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 2.5W @ 30°C 4.00°C/W @ 300 LFM 10.00°C/W Aluminum Black Anodized
APF19-19-13CB/A01

APF19-19-13CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

9,347 -
RFQ
APF19-19-13CB/A01

Datenblatt

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.500" (12.70mm) Thermal Tape, Adhesive (Included) - 4.00°C/W @ 200 LFM - Aluminum Black Anodized
573300D00000G

573300D00000G

TOP MOUNT HEATSINK .4" D2PAK

Boyd Laconia, LLC

1,508 -
RFQ
573300D00000G

Datenblatt

- Bulk Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) SMD Pad 1.3W @ 30°C 8.00°C/W @ 300 LFM 18.00°C/W Aluminum Tin
CR101-50AE

CR101-50AE

ALUMINUM HEATSINK 50MM BLK ANODI

Ohmite

312 -
RFQ
CR101-50AE

Datenblatt

CR Box Active Board Level, Vertical TO-101 Rectangular, Fins 1.969" (50.00mm) 1.969" (50.00mm) - - 3 Clips and PC Pin - - 5.30°C/W Aluminum Alloy Black Anodized
C247-025-1AE

C247-025-1AE

HEATSINK FOR TO-247 WITH 1 CLIP

Ohmite

6,482 -
RFQ
C247-025-1AE

Datenblatt

C Box Active Board Level, Vertical TO-247 Rectangular, Fins 0.984" (25.00mm) 1.500" (38.10mm) - 0.710" (18.03mm) Clip and PC Pin 5.0W @ 60°C 6.00°C/W @ 350 LFM - Aluminum Black Anodized
530102B00150G

530102B00150G

HEAT SINK 1.75" HIGH RISE TO-220

Boyd Laconia, LLC

2,671 -
RFQ
530102B00150G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
531302B02500G

531302B02500G

HEATSINK TO-220 H=2.5" BLK W/PIN

Boyd Laconia, LLC

1,034 -
RFQ
531302B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-220, TO-202 Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 6.0W @ 40°C 4.00°C/W @ 500 LFM 8.00°C/W Aluminum Black Anodized
ATS-CPX060060025-132-C2-R0

ATS-CPX060060025-132-C2-R0

HEATSINK 60X60X25MM XCUT CP

Advanced Thermal Solutions Inc.

5,915 -
RFQ
ATS-CPX060060025-132-C2-R0

Datenblatt

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.984" (25.00mm) Push Pin - 2.66°C/W @ 100 LFM - Aluminum Blue Anodized
6030B-TTG

6030B-TTG

THM,10594B-TT REV BB(COPPER)G

Boyd Laconia, LLC

2,395 -
RFQ
6030B-TTG

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin - - - Copper Tin, Black Paint
530101B00150G

530101B00150G

HEATSINK 1.75" HI RISE TO-218

Boyd Laconia, LLC

3,446 -
RFQ
530101B00150G

Datenblatt

- Bulk Active Board Level, Vertical TO-218 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
D10650-40

D10650-40

HEATSINK 100PQFP COMPOSITE

Wakefield-Vette

1,145 -
RFQ
D10650-40

Datenblatt

Deltem™ Tube Active Top Mount BGA Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - 0.400" (10.16mm) Thermal Tape, Adhesive (Not Included) 2.0W @ 40°C 25.00°C/W @ 350 LFM - Composite -
960-19-12-F-AB-0

960-19-12-F-AB-0

HEATSINK 19X12MM FRONT PUSH PIN

Wakefield-Vette

119 -
RFQ
960-19-12-F-AB-0

Datenblatt

960 Box Active Top Mount BGA Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.472" (12.00mm) Push Pin - 8.60°C/W @ 200 LFM - Aluminum Black Anodized
518-95AB

518-95AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette

2,907 -
RFQ
518-95AB

Datenblatt

518 Bulk Active Board Level Half Brick DC/DC Converter Rectangular, Fins 2.402" (61.00mm) 2.280" (57.91mm) - 0.950" (24.13mm) Bolt On 11.0W @ 60°C 2.00°C/W @ 300 LFM - Aluminum Black Anodized
960-19-15-D-AB-0

960-19-15-D-AB-0

HEATSINK 19X15MM DIA PUSH PIN

Wakefield-Vette

1,008 -
RFQ
960-19-15-D-AB-0

Datenblatt

960 Tray Active Top Mount BGA Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.590" (15.00mm) Push Pin - 6.80°C/W @ 200 LFM - Aluminum Black Anodized
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