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Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Form Länge Breite Durchmesser Lamellenhöhe Befestigungsmethode Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
SC1148

SC1148

ACTIVE COOLER

Raspberry Pi

775 -
RFQ
SC1148

Datenblatt

- Box Active - - - - - - - - - - - - -
7109DG

7109DG

TOP MOUNT HEATSINK .45" D2PAK

Boyd Laconia, LLC

5,401 -
RFQ
7109DG

Datenblatt

- Bag Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) SMD Pad 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
BDN18-3CB/A01

BDN18-3CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

354 -
RFQ
BDN18-3CB/A01

Datenblatt

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.355" (9.02mm) Thermal Tape, Adhesive (Included) - 3.50°C/W @ 400 LFM 10.80°C/W Aluminum Black Anodized
901-19-2-12-2-B-0

901-19-2-12-2-B-0

HEATSINK 19X19X12MM PIN

Wakefield-Vette

2,598 -
RFQ
901-19-2-12-2-B-0

Datenblatt

901 Box Active Top Mount BGA Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.457" (11.60mm) Push Pin - 6.60°C/W @ 200 LFM 12.70°C/W Aluminum Black Anodized
APF19-19-06CB/A01

APF19-19-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

839 -
RFQ
APF19-19-06CB/A01

Datenblatt

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) - 7.10°C/W @ 200 LFM - Aluminum Black Anodized
531002B02500G

531002B02500G

HEATSINK TO-220 W/PINS 1" TALL

Boyd Laconia, LLC

584 -
RFQ
531002B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
APF19-19-10CB/A01

APF19-19-10CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

3,434 -
RFQ
APF19-19-10CB/A01

Datenblatt

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) Thermal Tape, Adhesive (Included) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54270D-C1-R0

ATS-54270D-C1-R0

HEAT SINK 27MM X 27MM X 9.5MM

Advanced Thermal Solutions Inc.

2,391 -
RFQ
ATS-54270D-C1-R0

Datenblatt

- Bulk Active Top Mount BGA Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) Thermal Tape, Adhesive (Included) - 14.10°C/W @ 200 LFM - Aluminum Black Anodized
ATS-CPX060060006-205-C2-R0

ATS-CPX060060006-205-C2-R0

HEATSINK 60X60X6MM XCUT CP

Advanced Thermal Solutions Inc.

213 -
RFQ
ATS-CPX060060006-205-C2-R0

Datenblatt

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.236" (6.00mm) Push Pin - 13.00°C/W @ 100 LFM - Aluminum Blue Anodized
C40-058-AE

C40-058-AE

HEATSINK FOR TO-247 TO-264

Ohmite

1,168 -
RFQ
C40-058-AE

Datenblatt

C40 Box Active Board Level, Vertical TO-247, TO-264, SOT-227 Rectangular, Fins 2.283" (58.00mm) 1.724" (43.79mm) - 1.260" (32.00mm) Clip and Board Mounts - - - Aluminum Black Anodized
ATS-P1-138-C2-R0

ATS-P1-138-C2-R0

HEATSINK 25X25X15MM L-TAB T766

Advanced Thermal Solutions Inc.

965 -
RFQ
ATS-P1-138-C2-R0

Datenblatt

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) Push Pin - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
BDN18-6CB/A01

BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

349 -
RFQ
BDN18-6CB/A01

Datenblatt

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.605" (15.37mm) Thermal Tape, Adhesive (Included) - 2.80°C/W @ 400 LFM 8.10°C/W Aluminum Black Anodized
ATS-TI1OP-521-C1-R1

ATS-TI1OP-521-C1-R1

HEAT SINK FOR TI MOD #TPA3130D

Advanced Thermal Solutions Inc.

9,137 -
RFQ
ATS-TI1OP-521-C1-R1

Datenblatt

- Bulk Active Top Mount - Rectangular, Fins 1.969" (50.00mm) 0.547" (13.89mm) - 0.984" (25.00mm) Bolt On - 8.50°C/W @ 200 LFM - Aluminum Black Anodized
593002B03400G

593002B03400G

HEATSINK TWISTED FIN TO-220

Boyd Laconia, LLC

7,169 -
RFQ
593002B03400G

Datenblatt

Channel 5900 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
532702B02500G

532702B02500G

HEATSINK TO-220 SOLDERPIN 50.8MM

Boyd Laconia, LLC

484 -
RFQ
532702B02500G

Datenblatt

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
ATS-56001-C1-R0

ATS-56001-C1-R0

HEAT SINK 19MM X 19MM X 9MM

Advanced Thermal Solutions Inc.

2,924 -
RFQ
ATS-56001-C1-R0

Datenblatt

maxiFLOW Bulk Active Top Mount ASIC Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.354" (9.00mm) Thermal Tape, Adhesive (Included) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
APF30-30-13CB/A01

APF30-30-13CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

403 -
RFQ
APF30-30-13CB/A01

Datenblatt

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) Thermal Tape, Adhesive (Included) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54150D-C1-R0

ATS-54150D-C1-R0

HEAT SINK 15MM X 15MM X 9.5MM

Advanced Thermal Solutions Inc.

1,564 -
RFQ
ATS-54150D-C1-R0

Datenblatt

- Bulk Active Top Mount BGA Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) Thermal Tape, Adhesive (Included) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
APF40-40-06CB/A01

APF40-40-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

608 -
RFQ
APF40-40-06CB/A01

Datenblatt

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) - 3.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-55170D-C1-R0

ATS-55170D-C1-R0

HEAT SINK 17MM X 17MM X 9.5MM

Advanced Thermal Solutions Inc.

2,059 -
RFQ
ATS-55170D-C1-R0

Datenblatt

- Bulk Active Top Mount BGA Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) Thermal Tape, Adhesive (Included) - 28.00°C/W @ 200 LFM - Aluminum Black Anodized
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