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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Abstand - Paarung Anschluss Abstand - Pfosten Betriebstemperatur Kontaktoberfläche - Pfosten Gehäusematerial Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Abstand - Paarung Anschluss Abstand - Pfosten Betriebstemperatur Kontaktoberfläche - Pfosten Gehäusematerial Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten
ICM-314-1-GT-HT

ICM-314-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 14P

Adam Tech

1,458 -
RFQ
ICM-314-1-GT-HT

Datenblatt

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
DILB28P-223TLF

DILB28P-223TLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,755 -
RFQ
DILB28P-223TLF

Datenblatt

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
4816-3004-CP

4816-3004-CP

CONN IC DIP SOCKET 16POS TIN

3M

11,641 -
RFQ
4816-3004-CP

Datenblatt

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
110-47-308-41-001000

110-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,261 -
RFQ
110-47-308-41-001000

Datenblatt

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
4820-3000-CP

4820-3000-CP

CONN IC DIP SOCKET 20POS TIN

3M

4,510 -
RFQ
4820-3000-CP

Datenblatt

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
1-2199299-2

1-2199299-2

28P,DIP SKT,600 CL,LDR,PB FREE

TE Connectivity AMP Connectors

3,376 -
RFQ
1-2199299-2

Datenblatt

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Nickel
1-2199298-9

1-2199298-9

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

2,752 -
RFQ
1-2199298-9

Datenblatt

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
08-3518-10

08-3518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,190 -
RFQ
08-3518-10

Datenblatt

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICM-316-1-GT-HT

ICM-316-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 16P

Adam Tech

2,836 -
RFQ
ICM-316-1-GT-HT

Datenblatt

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
245-40-1-06

245-40-1-06

CONN IC DIP SOCKET 40POS TIN

CNC Tech

2,230 -
RFQ
245-40-1-06

Datenblatt

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
110-87-310-41-001101

110-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,346 -
RFQ
110-87-310-41-001101

Datenblatt

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-314-41-001101

110-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

5,221 -
RFQ
110-87-314-41-001101

Datenblatt

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
214-44-308-01-670800

214-44-308-01-670800

CONN IC DIP SOCKET 8POS TIN

Mill-Max Manufacturing Corp.

54,591 -
RFQ
214-44-308-01-670800

Datenblatt

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D2808-42

D2808-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

29,484 -
RFQ
D2808-42

Datenblatt

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
1-2199300-2

1-2199300-2

CONN IC DIP SOCKET 32POS TINLEAD

TE Connectivity AMP Connectors

3,112 -
RFQ
1-2199300-2

Datenblatt

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin-Lead 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polyester 60.0µin (1.52µm) Brass, Copper
4824-6000-CP

4824-6000-CP

CONN IC DIP SOCKET 24POS TIN

3M

1,866 -
RFQ
4824-6000-CP

Datenblatt

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
PLCC-44-AT-SMT

PLCC-44-AT-SMT

PLCC SOCKET 44P SMT

Adam Tech

2,286 -
RFQ
PLCC-44-AT-SMT

Datenblatt

PLCC Tube Active PLCC 44 (4 x 11) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Thermoplastic 80.0µin (2.03µm) Phosphor Bronze
ICM-318-1-GT-HT

ICM-318-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 18P

Adam Tech

2,175 -
RFQ
ICM-318-1-GT-HT

Datenblatt

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
2485264-1

2485264-1

DIP IC SOCKET 8P,GOLD FLASH

TE Connectivity AMP Connectors

4,766 -
RFQ
2485264-1

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
05-0513-10T

05-0513-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

1,152 -
RFQ
05-0513-10T

Datenblatt

0513 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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