IC-Sockel
| Foto | Hersteller-Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Typ | Anzahl der Positionen oder Stifte (Gitter) | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktmaterial - Paarung | Montageart | Funktionen | Abstand - Paarung | Anschluss | Abstand - Pfosten | Betriebstemperatur | Kontaktoberfläche - Pfosten | Gehäusematerial | Kontaktoberflächendicke - Pfosten | Kontaktmaterial - Pfosten |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D01-9970842CONN SOCKET SIP 8POS GOLD |
7,504 | - |
|
Datenblatt |
D01-997 | Tube | Active | SIP | 8 (1 x 8) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
D01-9970742CONN SOCKET SIP 7POS GOLD |
4,149 | - |
|
Datenblatt |
D01-997 | Tube | Active | SIP | 7 (1 x 7) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
4828-6000-CPCONN IC DIP SOCKET 28POS TIN |
3,233 | - |
|
Datenblatt |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
4818-3004-CPCONN IC DIP SOCKET 18POS TIN |
6,102 | - |
|
Datenblatt |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
4824-3000-CPCONN IC DIP SOCKET 24POS TIN |
5,558 | - |
|
Datenblatt |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
|
SA183040CONN IC DIP SOCKET 18POS GOLD |
411 | - |
|
Datenblatt |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Thermoplastic, Polyester, Glass Filled | 80.0µin (2.03µm) | Brass |
|
AR 14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD |
9,397 | - |
|
Datenblatt |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
110-99-314-41-001000CONN IC DIP SOCKET 14POS TINLEAD |
1,294 | - |
|
Datenblatt |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
AR 06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD |
3,552 | - |
|
Datenblatt |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
ICM-624-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P |
1,631 | - |
|
Datenblatt |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
|
ICM-320-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 20P |
633 | - |
|
Datenblatt |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
4828-3004-CPCONN IC DIP SOCKET 28POS TIN |
10,990 | - |
|
Datenblatt |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
D01-9971242CONN SOCKET SIP 12POS GOLD |
3,646 | - |
|
Datenblatt |
D01-997 | Tube | Active | SIP | 12 (1 x 12) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
|
1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE |
2,339 | - |
|
Datenblatt |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Nickel |
|
XR2A-0811-NCONN IC DIP SOCKET 8POS GOLD |
331 | - |
|
Datenblatt |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
D01-9970942CONN SOCKET SIP 9POS GOLD |
5,876 | - |
|
Datenblatt |
D01-997 | Tube | Active | SIP | 9 (1 x 9) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
|
SA143040CONN IC DIP SOCKET 14POS GOLD |
4,785 | - |
|
Datenblatt |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Thermoplastic, Polyester, Glass Filled | 80.0µin (2.03µm) | Brass |
|
4832-6000-CPCONN IC DIP SOCKET 32POS TIN |
2,433 | - |
|
Datenblatt |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
110-41-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
1,273 | - |
|
Datenblatt |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
PLCC-20-ATPLCC 20P THROUGH HOLE |
3,380 | - |
|
Datenblatt |
PLCC | Tube | Active | PLCC | 20 (4 x 5) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
