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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Abstand - Paarung Anschluss Abstand - Pfosten Betriebstemperatur Kontaktoberfläche - Pfosten Gehäusematerial Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten

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Foto Hersteller-Teil # Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Abstand - Paarung Anschluss Abstand - Pfosten Betriebstemperatur Kontaktoberfläche - Pfosten Gehäusematerial Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten
D01-9970842

D01-9970842

CONN SOCKET SIP 8POS GOLD

Harwin Inc.

7,504 -
RFQ
D01-9970842

Datenblatt

D01-997 Tube Active SIP 8 (1 x 8) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
D01-9970742

D01-9970742

CONN SOCKET SIP 7POS GOLD

Harwin Inc.

4,149 -
RFQ
D01-9970742

Datenblatt

D01-997 Tube Active SIP 7 (1 x 7) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
4828-6000-CP

4828-6000-CP

CONN IC DIP SOCKET 28POS TIN

3M

3,233 -
RFQ
4828-6000-CP

Datenblatt

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
4818-3004-CP

4818-3004-CP

CONN IC DIP SOCKET 18POS TIN

3M

6,102 -
RFQ
4818-3004-CP

Datenblatt

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
4824-3000-CP

4824-3000-CP

CONN IC DIP SOCKET 24POS TIN

3M

5,558 -
RFQ
4824-3000-CP

Datenblatt

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
SA183040

SA183040

CONN IC DIP SOCKET 18POS GOLD

On Shore Technology Inc.

411 -
RFQ
SA183040

Datenblatt

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
AR 14-HZL/01-TT

AR 14-HZL/01-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

9,397 -
RFQ
AR 14-HZL/01-TT

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
110-99-314-41-001000

110-99-314-41-001000

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

1,294 -
RFQ
110-99-314-41-001000

Datenblatt

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 06-HZL/07-TT

AR 06-HZL/07-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

3,552 -
RFQ
AR 06-HZL/07-TT

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
ICM-624-1-GT-HT

ICM-624-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 24P

Adam Tech

1,631 -
RFQ
ICM-624-1-GT-HT

Datenblatt

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
ICM-320-1-GT-HT

ICM-320-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 20P

Adam Tech

633 -
RFQ
ICM-320-1-GT-HT

Datenblatt

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
4828-3004-CP

4828-3004-CP

CONN IC DIP SOCKET 28POS TIN

3M

10,990 -
RFQ
4828-3004-CP

Datenblatt

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
D01-9971242

D01-9971242

CONN SOCKET SIP 12POS GOLD

Harwin Inc.

3,646 -
RFQ
D01-9971242

Datenblatt

D01-997 Tube Active SIP 12 (1 x 12) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
1-2199299-5

1-2199299-5

40P,DIP SKT,600 CL,LDR,PB FREE

TE Connectivity AMP Connectors

2,339 -
RFQ
1-2199299-5

Datenblatt

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Nickel
XR2A-0811-N

XR2A-0811-N

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

331 -
RFQ
XR2A-0811-N

Datenblatt

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
D01-9970942

D01-9970942

CONN SOCKET SIP 9POS GOLD

Harwin Inc.

5,876 -
RFQ
D01-9970942

Datenblatt

D01-997 Tube Active SIP 9 (1 x 9) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
SA143040

SA143040

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

4,785 -
RFQ
SA143040

Datenblatt

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
4832-6000-CP

4832-6000-CP

CONN IC DIP SOCKET 32POS TIN

3M

2,433 -
RFQ
4832-6000-CP

Datenblatt

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
110-41-308-41-001000

110-41-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,273 -
RFQ
110-41-308-41-001000

Datenblatt

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
PLCC-20-AT

PLCC-20-AT

PLCC 20P THROUGH HOLE

Adam Tech

3,380 -
RFQ
PLCC-20-AT

Datenblatt

PLCC Tube Active PLCC 20 (4 x 5) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
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