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Sockeladapter

Hersteller	Serie	Verpackung	Produktstatus	Konvertieren von (Adapterende)	Konvertieren nach (Adapterende)	Abstand - Paarung	Kontaktoberfläche – Paarung	Montageart	Anschluss	Abstand - Pfosten	Anzahl der Stifte	Kontaktoberfläche - Pfosten	Gehäusematerial	Platinenmaterial
3M Analog Devices Inc./Maxim Integrated Aries Electronics Logical Systems Corp. MikroElektronika TE Connectivity DEUTSCH Connectors Xeltek	* - 647 Correct-A-Chip® Correct-A-Chip® 1106396 Correct-A-Chip® 1107254 Correct-A-Chip® 1109342 Correct-A-Chip® 1109522 Correct-A-Chip® 1109523 Correct-A-Chip® 1110087 Correct-A-Chip® 1110267-N Correct-A-Chip® 1111163 Correct-A-Chip® 1111841 Correct-A-Chip® 1111903 Correct-A-Chip® 301296 Correct-A-Chip® 301550 Correct-A-Chip® 304235 Correct-A-Chip® 304504 Correct-A-Chip® 304538 Correct-A-Chip® 305263 Correct-A-Chip® 305479 Correct-A-Chip® 307349 Correct-A-Chip® 350000 Correct-A-Chip® 351000 Correct-A-Chip® 352000 Correct-A-Chip® 353000 Correct-A-Chip® 354000 Correct-A-Chip® 354W00 Correct-A-Chip® 35W000 Correct-A-Chip® 450001 Correct-A-Chip® 505 Correct-A-Chip® 555000 Correct-A-Chip® 650000 Correct-A-Chip® 651000 Correct-A-Chip® 652000 Correct-A-Chip® 653000 Correct-A-Chip® 655000 Correct-A-Chip® 6645 Correct-A-Chip® 665000 Correct-A-Chip® 666000 Correct-A-Chip® 95-132I25 Correct-A-Chip® 96-160M65 Correct-A-Chip® 96-208M50 Correct-A-Chip® 97-56001 Correct-A-Chip® 97-68340 Correct-A-Chip® 97-AQ132D DS9075 DX Textool™	- Bag Box Bulk Retail Package Tube	Active Discontinued at InFortune Obsolete	- AT90PWM2 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing HB2E Relay MSOP Multiple Packages PLCC PQFP QFP SIP Socket, 0.6" (15.24mm) Row Spacing SOIC SOIC-W SOJ SOWIC SSOP TQFP TSOP VQFP	- DIP DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing JEDEC PGA PLCC QFP SOIC SOWIC	- 0.020" (0.50mm) 0.024" (0.60mm) 0.025" (0.64mm) 0.026" (0.65mm) 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- Gold Silver Tin Tin-Lead	- Surface Mount Through Hole	- Solder Wire Wrap	- 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- 10 100 12 128 132 14 144 16 160 169 18 184 20 208 22 24 28 32 36 40 42 44 48 52 56 60 64 68 8 80 84 90	- Gold Tin Tin-Lead	- Polyamide (PA46), Nylon 4/6, Glass Filled Polyester Polyphenylene Sulfide (PPS) Polysulfone (PSU), Glass Filled	- FR4 Epoxy Glass Polyimide (PI)

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Hersteller-Teil #	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Konvertieren von (Adapterende)	Konvertieren nach (Adapterende)	Abstand - Paarung	Kontaktoberfläche – Paarung	Montageart	Anschluss	Abstand - Pfosten	Anzahl der Stifte	Kontaktoberfläche - Pfosten	Gehäusematerial	Platinenmaterial
240-3639-09-0602J RECEPTACLE DIP SOCKET 40POS 1.0" 3M	-	RFQ	Datenblatt	Textool™	Box	Active	DIP, 1.0" (25.40mm) Row Spacing	DIP, 1.0" (25.40mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	40	Gold	Polysulfone (PSU), Glass Filled	-
PA-TS1D6SM18-56 ADAPTER 56TSOP TO 56DIP Logical Systems Inc.	-	RFQ	Datenblatt	-	Bulk	Active	TSOP	DIP	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	56	-	-	-
24-354000-20 SOCKET ADAPTER DIP TO 24SOIC Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 354000	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	SOIC	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	24	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-650000-11-RC-P SOCKET ADAPTER SOIC TO 24DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 650000	Bulk	Discontinued	SOIC	DIP, 0.6" (15.24mm) Row Spacing	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	24	Gold	-	FR4 Epoxy Glass
36-651000-10 SOCKET ADAPTER 36POS SSOP/DIP .6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	36	Tin-Lead	-	FR4 Epoxy Glass
28-354000-20 SOCKET ADAPTER DIP TO 28SOIC Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 354000	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOIC	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	28	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-354000-11-RC SOCKET ADAPTER DIP TO 28SOIC Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 354000	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	SOIC	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	28	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-651000-10 SOCKET ADAPTER SSOP TO 14DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	14	Tin-Lead	-	FR4 Epoxy Glass
16-651000-10 SOCKET ADAPTER SSOP TO 16DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	16	Tin-Lead	-	FR4 Epoxy Glass
20-651000-10 SOCKET ADAPTER SSOP TO 20DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	20	Tin-Lead	-	FR4 Epoxy Glass
24-651000-10 SOCKET ADAPTER SSOP TO 24DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	24	Tin-Lead	-	FR4 Epoxy Glass
228-1277-39-0602J RECEPTACLE DIP SOCKET 28POS .6" 3M	-	RFQ	Datenblatt	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	28	Gold	Polysulfone (PSU), Glass Filled	-
224-5248-19-0602J RECEPTACLE DIP SOCKET 24POS .3" 3M	-	RFQ	Datenblatt	Textool™	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	24	Gold	Polysulfone (PSU), Glass Filled	-
96-128M80 QFP TO PGA 128 PIN Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip®	-	Obsolete	QFP	PGA	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	128	Tin-Lead	-	FR4 Epoxy Glass
28-651000-10 SOCKET ADAPTER SSOP TO 28DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 651000	Bulk	Active	SSOP	DIP, 0.6" (15.24mm) Row Spacing	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	28	Tin-Lead	-	FR4 Epoxy Glass
264-4493-19-0602J RECEPTACLE DIP SOCKET 64POS .9" 3M	-	RFQ	Datenblatt	Textool™	Box	Active	DIP, 0.9" (22.86mm) Row Spacing	DIP, 0.9" (22.86mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Wire Wrap	0.100" (2.54mm)	64	Gold	Polysulfone (PSU), Glass Filled	-
28-653000-11-RC SOCKET ADAPTER PLCC TO 28DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 653000	Bulk	Active	PLCC	DIP, 0.6" (15.24mm) Row Spacing	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	28	Gold	-	FR4 Epoxy Glass
32-655000-10 SOCKET ADAPTER TSOP TO 32DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 655000	Bulk	Active	TSOP	DIP, 0.6" (15.24mm) Row Spacing	0.020" (0.50mm)	Silver	Through Hole	Solder	0.100" (2.54mm)	32	Tin-Lead	-	FR4 Epoxy Glass
24-650000-11-RC SOCKET ADAPTER SOIC TO 24DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 650000	Tube	Active	SOIC	DIP, 0.6" (15.24mm) Row Spacing	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	24	Gold	-	FR4 Epoxy Glass
28-652000-11-RC SOCKET ADAPTER PLCC TO 28DIP 0.6 Aries Electronics	-	RFQ	Datenblatt	Correct-A-Chip® 652000	Bulk	Active	PLCC	DIP, 0.6" (15.24mm) Row Spacing	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	28	Gold	-	FR4 Epoxy Glass

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00852-69118296